• Mixed Analog/Digital
• Power Supply
• RF
• High Speed
• EMC compliant designs
• Surface Mount and Through Hole Technology
• Fine pitch components SQFP, TSSOP, 0201 discretes to large BGA's
• HDI (High Desity Interconnect)
• Blind vias, via in pad.
• Flex, Double sided and Multi Layer designs
• Controlled impedance
• Edge/Broadside coupled differential pairs
• DDR, PCI-X, Gigabit Ethernet and VME64X

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