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Mixed Analog/Digital,Power Supply,
RF ,EMC compliant
designs
Surface Mount and Through Hole Technology
Fine pitch components SQFP, TSSOP, 0201 discretes, 0.8 mm BGA's
High Desity Interconnect, blind vias, aspect ratios
Flex, Double sided and Multi Layer designs (28 layers)
Board thickness's of .032”/.200”, high TG FR4
Aspect ratios of 7:1 to 14:1
Controlled impedance termination
Edge coupled differential pairs
Minimum conductor parameters .003” track/.003” spacing
APF Circuit Design Inc.
Ottawa, Ontario, Canada
Copyright 2004-2008 APF Circuit Design Inc. All Rights Reserved.
Technology