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• Mixed Analog/Digital,Power Supply, RF ,EMC compliant designs
• Surface Mount and Through Hole Technology
• Fine pitch components SQFP, TSSOP, 0201 discretes, 0.8 mm BGA's
• High Desity Interconnect, blind vias, aspect ratios
• Flex, Double sided and Multi Layer designs (28 layers)
• Board thickness's of .032”/.200”, high TG FR4
• Aspect ratios of 7:1 to 14:1
• Controlled impedance termination
• Edge coupled differential pairs
• Minimum conductor parameters .003” track/.003” spacing

APF Circuit Design Inc.

Ottawa, Ontario, Canada

Copyright 2004-2008 APF Circuit Design  Inc. All Rights Reserved.

Technology