Specifications used at APF Circuit Design Inc. are numerous but listed below are just a few of the more referenced documents.

IPC-421 General Specification for Rigid Printed Board Backplanes with Press-Fit Contacts

IPC-2141A - Design Guide for High-Speed Controlled Impedance Circuit Boards

IPC-2221 Generic Standard on Printed Board Design

IPC-2222 Sectional Design Standard for Flexible Organic Printed Boards

IPC-2223 Sectional Design Standard for Flexible Organic Printed Boards

IPC-2224 Sectional Standard for Design of PWB’s for PC Cards

IPC-2226 Design Standard for High Density Interconnect (HDI) Printed Boards

IPC-2251 Design Guide for Packaging of High Speed Electronic Circuits

IPC-2252 Design Guide for RF/ Microwave Circuit Boards

IPC/JPCA-2315 Design Guide for High Density Interconnects and Micro Vias

IPC-7095 Design and assembly Process Implementation for BGA’s

IPC-SM-7351 (Formerly 782) Surface Mount Design and Land Pattern Standard

MIL-C-28809B Circuit Card Assemblies, Rigid, Flexible, and Rigid-Flex

MIL-P-50884C Printed Wiring, Flexible and Rigid Flex

APF Circuit Design Inc.

Ottawa, Ontario, Canada