Specifications used at APF Circuit Design Inc. are numerous but listed below are just a few of the more referenced documents.
IPC-421 General Specification for Rigid Printed Board Backplanes with Press-Fit Contacts
IPC-2141A - Design Guide for High-Speed Controlled Impedance Circuit Boards
IPC-2221 Generic Standard on Printed Board Design
IPC-2222 Sectional Design Standard for Flexible Organic Printed Boards
IPC-2223 Sectional Design Standard for Flexible Organic Printed Boards
IPC-2224 Sectional Standard for Design of PWB’s for PC Cards
IPC-2226 Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-2251 Design Guide for Packaging of High Speed Electronic Circuits
IPC-2252 Design Guide for RF/ Microwave Circuit Boards
IPC/JPCA-2315 Design Guide for High Density Interconnects and Micro Vias
IPC-7095 Design and assembly Process Implementation for BGA’s
IPC-SM-7351 (Formerly 782) Surface Mount Design and Land Pattern Standard
MIL-C-28809B Circuit Card Assemblies, Rigid, Flexible, and Rigid-Flex
MIL-P-50884C Printed Wiring, Flexible and Rigid Flex
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